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Chapter 1 - Advanced Polyimide Films
Shi-Yong Yang and Li-Li Yuan
Pages 1-66 - Book chapterAbstract only
Chapter 2 - Advanced Polyimide Fibers
Qing-Hua Zhang, Jie Dong and De-Zhen Wu
Pages 67-92 - Book chapterAbstract only
Chapter 3 - Polyimide Matrices for Carbon Fiber Composites
Shi-Yong Yang and Mian Ji
Pages 93-136 - Book chapterAbstract only
Chapter 4 - Super Engineering Plastics and Forms
Shi-Yong Yang, Hai-Xia Yang and Ai-Jun Hu
Pages 137-193 - Book chapterAbstract only
Chapter 5 - Polyimides for Electronic Applications
Qing-Hua Lu and Feng Zheng
Pages 195-255 - Book chapterAbstract only
Chapter 6 - Polyimide Gas Separation Membranes
Xiao-Hua Ma and Shi-Yong Yang
Pages 257-322 - Book chapterAbstract only
Chapter 7 - Polyimide Proton Exchange Membranes
Jian-Hua Fang
Pages 323-383 - Book chapterAbstract only
Chapter 8 - Soluble and Low-κ Polyimide Materials
Yi Zhang and Wei Huang
Pages 385-463 - Book chapterNo access
Index
Pages 465-483
About the book
Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.
The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.
The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.
Key Features
- Reviews the latest research, development and future prospective of polyimides
- Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers
- Presents a highly organized work that is composed of different sections that are easily compared
- Reviews the latest research, development and future prospective of polyimides
- Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers
- Presents a highly organized work that is composed of different sections that are easily compared
Details
ISBN
978-0-12-812640-0
Language
English
Published
2018
Copyright
Copyright © 2018 Elsevier Inc. All rights reserved.
Imprint
Elsevier