Cover for Advanced Adhesives in Electronics

Advanced Adhesives in Electronics

Materials, Properties and Applications

A volume in Woodhead Publishing Series in Electronic and Optical Materials

Book2011

Edited by:

M.O. Alam and C. Bailey

Advanced Adhesives in Electronics

Materials, Properties and Applications

A volume in Woodhead Publishing Series in Electronic and Optical Materials

Book2011

 

Cover for Advanced Adhesives in Electronics

Edited by:

M.O. Alam and C. Bailey

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Book description

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few ... read full description

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  2. Book chapterAbstract only

    1 - Introduction to adhesives joining technology for electronics

    M.O. Alam and C. Bailey

    Pages 1-12

  3. Book chapterNo access

    Index

    Pages 259-268

About the book

Description

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.

The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.

With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.

The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.

With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Key Features

  • Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications
  • Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems
  • Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
  • Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications
  • Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems
  • Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Details

ISBN

978-1-84569-576-7

Language

English

Published

2011

Copyright

Copyright © 2011 Woodhead Publishing Limited. All rights reserved.

Imprint

Woodhead Publishing

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Editors

M.O. Alam

C. Bailey