Cover for Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

A volume in Materials and Processes for Electronic Applications

Book • Second Edition2011

Authors:

James J. Licari and Dale W. Swanson

Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

A volume in Materials and Processes for Electronic Applications

Book • Second Edition2011

 

Cover for Adhesives Technology for Electronic Applications

Authors:

James J. Licari and Dale W. Swanson

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Book description

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well vers ... read full description

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Table of contents

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  2. Book chapterAbstract only

    1 - Introduction

    Pages 1-34

  3. Book chapterAbstract only

    2 - Functions and theory of adhesives

    Pages 35-74

  4. Book chapterAbstract only

    Chapter 3 - Chemistry, Formulation, and Properties of Adhesives

    Pages 75-141

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    Chapter 4 - Adhesive Bonding Processes

    Pages 143-216

  6. Book chapterAbstract only

    Chapter 5 - Applications

    Pages 217-288

  7. Book chapterAbstract only

    Chapter 6 - Reliability

    Pages 289-344

  8. Book chapterAbstract only

    Chapter 7 - Test and Inspection Methods

    Pages 345-377

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    Appendix

    Pages 379-384

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    Index

    Pages 385-403

About the book

Description

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.

The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.

As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:

• Tamper-proof adhesives for electronic security devices.

• Bio-compatible adhesives for implantable medical devices.

• Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).

• Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.

The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.

As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:

• Tamper-proof adhesives for electronic security devices.

• Bio-compatible adhesives for implantable medical devices.

• Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).

• Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Key Features

  • A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals
  • Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device
  • Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel
  • A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals
  • Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device
  • Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel

Details

ISBN

978-1-4377-7889-2

Language

English

Published

2011

Copyright

Copyright © 2011 Elsevier Inc. All rights reserved

Imprint

William Andrew

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Authors

James J. Licari

Dale W. Swanson