Cover for Advanced Organics for Electronic Substrates and Packages

Advanced Organics for Electronic Substrates and Packages

Book1992

Authors:

Andrew E Fletcher

Advanced Organics for Electronic Substrates and Packages

Book1992

 

Cover for Advanced Organics for Electronic Substrates and Packages

Authors:

Andrew E Fletcher

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Book description

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industr ... read full description

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Table of contents

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  2. Book chapterNo access

    1 - INTRODUCTION

    Pages 12-30

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    2 - MARKETS

    Pages 31-41

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    3 - PRODUCTION

    Pages 42-49

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    4 - APPLICATIONS

    Pages 50-98

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    5 - MATERIALS

    Pages 99-117

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    6 - THERMOSET POLYMERS

    Pages 118-136

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    7 - THERMOPLASTIC COMPOUNDS

    Pages 137-166

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    8 - SILICONES

    Pages 167-173

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    9 - ACTIVITIES BY COMPANIES AND ORGANISATIONS

    Pages 174-230

About the book

Description

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.

Details

ISBN

978-1-4831-3319-5

Language

English

Published

1992

Copyright

Copyright © 1992 Elsevier Ltd. All rights reserved.

Imprint

Elsevier

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Authors

Andrew E Fletcher